Книга 3D Stacked Chips IBRAHIM  AB ELFADEL

3D Stacked Chips

From Emerging Processes to Heterogeneous Systems

Автор: IBRAHIM AB ELFADEL
Език: Английски език
Корици: С меки корици
Наличност: Външен склад
Изпращаме след 5-8 дни
51.77 101.26 лв
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integrati...

Информация за книгата

Автор
Език
Английски език
Корици
Книга - С меки корици
Издадена
2018
страници
339
EAN
9783319793054
ISBN
9783319793054
Enbook ID
19684593
Теглоt
5504
Размери
155 x 235 x 20

Пълно описание

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

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