Advances in Rapid Thermal and Integrated Processing

Name: Advances in Rapid Thermal and Integrated Processing
Brand: Springer
SKU: 9780792340119
Price: 419.16 EUR
Availability: InStock

Автор: F. Roozeboom

Език:

Корици: С твърди корици

Издател: Springer

Наличност: Външен склад

Изпращаме след 10-13 дни

419.16 € 819.80 лв

Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor...

Информация за книгата

Автор

F. Roozeboom

Език

Английски език

Корици

Книга - С твърди корици

Издадена

1996

страници

566

EAN

9780792340119

ISBN

0792340116

Enbook ID

01395064

Издател

Springer

Теглоt

2180

Размери

155 x 235 x 37

Пълно описание

Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.

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Advances in Rapid Thermal and Integrated Processing

Информация за книгата

Пълно описание

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