Книга Electronic Packaging Materials Science VIII: Volume 390 Peter BKenneth A. JacksonRobert C. SundahlKing-Ning Tu

Electronic Packaging Materials Science VIII: Volume 390

Език: Английски език
Корици: С твърди корици
Издател: Materials Research Society
Наличност: Очаква се допечатка
Срокът не е известен
27.07 52.94 лв
The dynamic nature of the microelectronics industry, in particular within the area of packaging, req...

Информация за книгата

Език
Английски език
Корици
Книга - С твърди корици
Издадена
1995
страници
284
EAN
9781558992931
ISBN
1558992936
Enbook ID
02060053
Теглоt
591
Размери
160 x 234 x 23

Пълно описание

The dynamic nature of the microelectronics industry, in particular within the area of packaging, requires a continuous updating and revision of priorities. In an effort to communicate these priorities to researchers and engineers in the field, the National Technology Road Map was developed. This proceedings volume, the eighth in a series on electronic packaging, focuses on the materials research, development and processing issues identified in the road map. Topics include: an overview of the National Technology Road Map for Semiconductors; institutional and industrial perspectives; impact on materials needs and materials science issues; and research responses. Technical subtopics include polymers, ceramics, solder and composites.

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