Embedded Dielectrics for Electronic Packaging

Name: Embedded Dielectrics for Electronic Packaging
Brand: World Scientific Publishing Co Pte Ltd
SKU: 9789814619417
Price: 181.44 EUR
Availability: PreOrder

Автор: Shuhui Yu, Ching-Ping Wong, Rong Sun

Език:

Корици: С твърди корици

Издател: World Scientific Publishing Co Pte Ltd

Наличност: Очакван нов продукт

Издание 31. 03. 2027

181.44 € 354.86 лв

This book provides an overview of nanocomposite materials that can be used as embedded dielectric la...

Информация за книгата

Автор

Shuhui Yu, Ching-Ping Wong, Rong Sun

Език

Английски език

Корици

Книга - С твърди корици

Издадена

2015

страници

300

EAN

9789814619417

ISBN

9814619418

Enbook ID

05349964

Издател

World Scientific Publishing Co Pte Ltd

Теглоt

406

Пълно описание

This book provides an overview of nanocomposite materials that can be used as embedded dielectric layer in high-density electronic packaging, for decoupling, filtering, energy storage or electrostatic discharge suppressing etc. Some fundamental models used to analyze or predict the dielectric behavior of ceramic/polymer, conductor/polymer, and semiconductor/polymer composites are reviewed. This book also introduces design and synthesis of some novel hybrid filler particles, as well as graft modification on the polymer matrix to improve dielectric performance.

Може също да ви хареса

Най-често търсени

Categories

Authors

Publishers

Продукти

Продукти

Най-често търсени

Categories

Authors

Publishers

Продукти

Продукти

Embedded Dielectrics for Electronic Packaging

Информация за книгата

Пълно описание

Може също да ви хареса

100% Monnaie

Dreadful Tales

Interview With The Vampire

Kensuke's Kingdom

Dante's Comedy: Introductory Readings of Selected Cantos

1 Corinthians

Credit and Blame

Somebody Had To Do It

Fountain Sealed