Encapsulation Materials for Neural Interface Devices

Name: Encapsulation Materials for Neural Interface Devices
Brand: VDM Verlag
SKU: 9783639140750
Price: 68.86 EUR
Availability: InStock

Автор: Jui-Mei Hsu

Език:

Корици: С меки корици

Издател: VDM Verlag

Наличност: Външен склад

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68.86 € 134.67 лв

Neural interface devices have been developed for §neuroscience and neuroprosthetics applications to...

Информация за книгата

Автор

Jui-Mei Hsu

Език

Английски език

Корици

Книга - С меки корици

Издадена

2009

страници

184

EAN

9783639140750

ISBN

3639140753

Enbook ID

06822710

Издател

VDM Verlag

Теглоt

277

Размери

152 x 229 x 11

Пълно описание

Neural interface devices have been developed for §neuroscience and neuroprosthetics applications to §record and stimulate nerve signals. Chronic use of §these devices is prevented by their lack of long-§term stability, due to device failure or immune §system responses. §Conformal, hermetic, biocompatible, and electrically §insulating coating materials that sustain chronic §implantation and guarantee stable recording or §stimulation are needed. Even though a large §selection of materials has been proposed and tested §for this purpose, to date, no material §presented in scientific literature has been §thoroughly characterized and qualified as a long-§term hermetic encapsulation material for silicon-§based neural interface devices. §In this work, hydrogenated amorphous silicon carbide §(a-SiCx:H) and Parylene-C films were investigated as §the encapsulation materials. The deposition §parameters and corresponding film properties were §explored and correlated with the encapsulation §characteristics.

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Encapsulation Materials for Neural Interface Devices

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