High Frequency Interconnect Characterization and Modeling

Name: High Frequency Interconnect Characterization and Modeling
Brand: VDM Verlag
SKU: 9783639130959
Price: 59.81 EUR
Availability: InStock

For VLSI On-Chip Interconnects and RF Package Wire Bonds

Автор: Xiaoning Qi

Език:

Корици: С меки корици

Издател: VDM Verlag

Наличност: Външен склад

Изпращаме след 9-15 дни

59.81 € 116.98 лв

Continuous scaling of transistors combined with§increased chip area results in the ratio of global§w...

Информация за книгата

Автор

Xiaoning Qi

Език

Английски език

Корици

Книга - С меки корици

Издадена

2009

страници

132

EAN

9783639130959

ISBN

3639130952

Enbook ID

06821831

Издател

VDM Verlag

Теглоt

204

Размери

152 x 229 x 8

Пълно описание

Continuous scaling of transistors combined with§increased chip area results in the ratio of global§wire delay to gate delay increasing at a super-linear§rate. Simple RC models have become inadequate for§simulation of VLSI circuits. In addition, parasitic§inductance and capacitance of IC packages impose§limits on the circuit performance at RF frequencies.§This book presents modeling of on-chip inductance for§chips with ground grids that emulate those used in§real circuits. S-parameter characterization of test§chips up to 10 GHz shows good agreement with§simulation and analytical calculations. On-chip 3-D§capacitance modeling capabilities for arbitrarily§shaped objects are also presented. In addition, an§approach to fast 3-D modeling of the geometry for§bonding wires in RF circuits and packages is§demonstrated. The geometry and an equivalent circuit§are presented to model the frequency response of§bonding wires. Excellent agreement between modeled§results and measured data is achieved for frequencies§up to 10 GHz. The book should be useful to the§semiconductor professionals in academia and industry,§who are interested in the on-chip and package§interconnects researches.

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High Frequency Interconnect Characterization and Modeling

For VLSI On-Chip Interconnects and RF Package Wire Bonds

Информация за книгата

Пълно описание

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