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Книга Modeling and Application of Flexible Electronics Packaging Yongan Huang

Modeling and Application of Flexible Electronics Packaging

Автор: Yongan Huang, Zhouping Yin, Xiaodong Wan
Език: Английски език
Корици: С твърди корици
Издател: Springer Verlag, Singapore
Наличност: Външен склад
Изпращаме след 10-13 дни
105.06 € 205.48 лв
This book systematically discusses the modeling and application of transfer manipulation for flexibl...

Информация за книгата

Автор
Yongan Huang, Zhouping Yin, Xiaodong Wan
Език
Английски език
Корици
Книга - С твърди корици
Издадена
2019
страници
287
EAN
9789811336263
Enbook ID
20638270
Издател
Springer Verlag, Singapore
Теглоt
629
Размери
155 x 235 x 22

Пълно описание

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.

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