Книга Passive Chemical Project Rajendra Parsad

Passive Chemical Project

Project in the past

Автор: Rajendra Parsad
Език: Английски език
Корици: С меки корици
Наличност: Външен склад
Изпращаме след 5-8 дни
72.05 140.91 лв
The corrosion current of bare copper metal was determined in ferric ion and in hydrogen peroxide sol...

Информация за книгата

Автор
Език
Английски език
Корици
Книга - С меки корици
Издадена
2013
страници
216
EAN
9783838333373
Enbook ID
02265664
Теглоt
340
Размери
150 x 220 x 13

Пълно описание

The corrosion current of bare copper metal was determined in ferric ion and in hydrogen peroxide solutions and was found to be close to the CMP rate reported in the literature. This leads to the new conclusion that copper CMP is mainly a corrosive wear process that occurs at the abraded spots on the wafer surface, the high spots. Cu(I)BTA film forms only at the low areas which are not being abraded. This finding calls for the revision of the conventional view that CMP involves a successive sequence of film formation and removal.

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