Physical Design for Multichip Modules

Name: Physical Design for Multichip Modules
Brand: Springer, Berlin
SKU: 9780792394501
Price: 158.03 EUR
Availability: InStock

Автор: Mysore Sriram, Sung-Mo (Steve) Kang

Език:

Корици: С твърди корици

Издател: Springer, Berlin

Наличност: Външен склад

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158.03 € 309.07 лв

Physical Design for Multichip Modules collects together a large body of important research work that...

Информация за книгата

Автор

Mysore Sriram, Sung-Mo (Steve) Kang

Език

Английски език

Корици

Книга - С твърди корици

Издадена

1994

страници

197

EAN

9780792394501

ISBN

079239450X

Enbook ID

01398239

Издател

Springer, Berlin

Теглоt

490

Размери

156 x 234 x 15

Пълно описание

Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. Points of interest include : Clear overview of MCM technology and its relationship to physical design; Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; Different approaches to multilayer MCM routing collected together and compared for the first time; Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; Quantitative data provided wherever possible for comparison of different approaches; A comprehensive list of references to recent literature on MCMs provided.

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Информация за книгата

Пълно описание

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