Reliability Technology for Integrated Circuit Packaging

Name: Reliability Technology for Integrated Circuit Packaging
Brand: Springer-Verlag GmbH
SKU: 9789819538843
Price: 165.02 EUR
Availability: InStock

Автор: Yunfei En, Si Chen

Език:

Корици: С твърди корици

Издател: Springer-Verlag GmbH

Наличност: Външен склад

Изпращаме след 10-13 дни

165.02 € 322.76 лв

This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms,...

Информация за книгата

Автор

Yunfei En, Si Chen

Език

Английски език

Корици

Книга - С твърди корици

Издадена

2026

страници

509

EAN

9789819538843

ISBN

981953884X

Enbook ID

49699488

Издател

Springer-Verlag GmbH

Теглоt

1010

Пълно описание

This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.

Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.

Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.

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Reliability Technology for Integrated Circuit Packaging

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