Книга Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture E.H. Wong

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Автор: E.H. Wong, S.K. Woon, Y. W. Mai
Език: Английски език
Корици: С твърди корици
Наличност: Налично при издателя, по поръчка
Изпращаме след 28-34 дни
191.31 374.18 лв
The reliability of components is a prime concern to electronics manufacturers and the failure of mic...

Информация за книгата

Език
Английски език
Корици
Книга - С твърди корици
Издадена
2015
страници
482
EAN
9781845695286
ISBN
1845695283
Enbook ID
05098486
Теглоt
830
Размери
152 x 229 x 30

Пълно описание

The reliability of components is a prime concern to electronics manufacturers and the failure of microelectronic packaging is a major source of component faults. Failure of electronic packaging: Effects of temperature, moisture and mechanical driving forces provides a thorough review of this important field of research. This practical guide discusses theoretical aspects, experimental results, modeling techniques and results. The authors have used their extensive experience to produce detailed chapters covering temperature, moisture and mechanical shock induced failure in addition to adhesive interconnects and viscoelasticity. Useful program files and macros are included.

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