SiP System-in-Package Design and Simulation

Mentor EE Flow Advanced Design Guide

Автор: Liu Yang

Език:

Корици: С твърди корици

Издател: John Wiley and Sons Ltd

Наличност: Външен склад

Изпращаме след 10-18 дни

148.45 € 290.34 лв

An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design fl...

Информация за книгата

Автор

Liu Yang

Език

Английски език

Корици

Книга - С твърди корици

Издадена

2017

страници

496

EAN

9781119045939

ISBN

9781119045939

Enbook ID

10918283

Издател

John Wiley and Sons Ltd

Теглоt

896

Размери

252 x 177 x 30

Пълно описание

An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies design FlipChip and RDL design Routing and coppering 3D Real-Time DRC check SiP simulation technology Mentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.

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SiP System-in-Package Design and Simulation

Mentor EE Flow Advanced Design Guide

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