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Solder Joint Technology

Name: Solder Joint Technology
Brand: Springer-Verlag New York Inc.
SKU: 9780387388908
Price: 261.05 EUR
Availability: InStock

Materials, Properties, and Reliability

Автор: King-Ning Tu

Език:

Корици: С твърди корици

Издател: Springer-Verlag New York Inc.

Наличност: Външен склад в ограничено количество

Изпращаме след 13-18 дни

261.05 € 510.57 лв

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to...

Информация за книгата

Автор

King-Ning Tu

Език

Английски език

Корици

Книга - С твърди корици

Издадена

2007

страници

370

EAN

9780387388908

ISBN

0387388907

Enbook ID

01382091

Издател

Springer-Verlag New York Inc.

Теглоt

1590

Размери

156 x 235 x 24

Пълно описание

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.