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Stochastic Finite Element Modeling in Electronic Packaging

Name: Stochastic Finite Element Modeling in Electronic Packaging
Brand: John Wiley & Sons Inc
SKU: 9781394352944
Price: 102.06 EUR
Availability: InStock

Автор: L Chu

Език:

Корици: С твърди корици

Издател: John Wiley & Sons Inc

Наличност: Външен склад

Изпращаме след 14-21 дни

102.06 € 199.61 лв

An expert integration of digital twin technology and advanced simulation methods for the design and...

Информация за книгата

Автор

L Chu

Език

Английски език

Корици

Книга - С твърди корици

Издадена

2026

страници

288

EAN

9781394352944

Enbook ID

48689678

Издател

John Wiley & Sons Inc

Теглоt

666

Пълно описание

An expert integration of digital twin technology and advanced simulation methods for the design and optimization of electronic packaging systems In Stochastic Finite Element Modeling in Electronic Packaging, distinguished researcher Liu Chu delivers an expert discussion of the latest advanced numerical methods and modeling techniques specific to electronic packaging. The book supplements its explanations with original MATLAB and ANSYS (APDL) code that can be applied immediately. It also includes robust examples that draw on a comprehensive description of the mechanics of electronic packaging modeling. Chu explains the fundamentals of modeling logic and concepts in an accessible way that is ideal for beginners to the topic. She demonstrates practical guides and benchmarks that will assist readers in the testing, measurement, and modeling of their own materials. Readers will also find: A thorough introduction to a modeling approach that focuses on digital twins and big data applications, including Monte Carlo SamplingComprehensive explorations of benchmarks, testing, measurement, and modelingPractical discussions of theoretical finite element models in electronic packagingComplete treatments of the fundamentals of modeling logic and concepts Perfect for undergraduate and graduate students in electrical engineering and computer science, Stochastic Finite Element Modeling in Electronic Packaging will also benefit practicing electronic design engineers and academic researchers with an interest in electronic packaging and materials science.