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Thin-Film Capacitors for Packaged Electronics

Name: Thin-Film Capacitors for Packaged Electronics
Brand: Springer, Berlin
SKU: 9781402077050
Price: 105.02 EUR
Availability: InStock

Автор: Jain Pushkar, Eugene J. Rymaszewski

Език:

Корици: С твърди корици

Издател: Springer, Berlin

Наличност: Външен склад

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105.02 € 205.40 лв

Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still need...

Информация за книгата

Автор

Jain Pushkar, Eugene J. Rymaszewski

Език

Английски език

Корици

Книга - С твърди корици

Издадена

2004

страници

158

EAN

9781402077050

ISBN

140207705X

Enbook ID

05256401

Издател

Springer, Berlin

Теглоt

950

Размери

156 x 234 x 11

Пълно описание

Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to limits of what's the best one can achieve in capacitor properties to process modeling to application examples. Some of the topics covered are the following: -Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structures, -Electrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz),-Process modeling to determine stable operating points, -Prevention of metal (Cu) diffusion into the dielectric, -Measurements and modeling of the dielectric micro-roughness. Capacitors were invented in 1745 and have served as portable electrical charge storage devices ever since. During the 19th century a general understanding of electro-magnetism was gradually developed. Electronic devices and circuits were pioneered in the early 20th century and, by its end, revolutionized the generation, processing, storage and transmission of information. No evolutionary limits have yet been approached. Strictly speaking, all circuits have capacitors; often not wanted, considered parasitic capacitors, such as capacitance of signal interconnections. A great deal of effort in academia and industry attempts to reduce the value of the parasitic capacitors by means of novel materials and structures with the lowest dielectric constant. Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to limits of what's the best one can achieve in capacitor properties to process modeling to application examples. Some of the topics covered are the following: §-Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structures, -Electrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz), -Process modeling to determine stable operating points, -Prevention of metal (Cu) diffusion into the dielectric, -Measurements and modeling of the dielectric micro-roughness.

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