Wafer Bonding

Name: Wafer Bonding
Brand: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
SKU: 9783642059155
Price: 367.84 EUR
Availability: InStock

Applications and Technology

Автор: Marin Alexe, Ulrich Gösele

Език:

Корици: С меки корици

Издател: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG

Наличност: Външен склад

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367.84 € 719.43 лв

The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCS...

Информация за книгата

Автор

Marin Alexe, Ulrich Gösele

Език

Английски език

Корици

Книга - С меки корици

Издадена

2011

страници

504

EAN

9783642059155

ISBN

3642059155

Enbook ID

01651230

Издател

Springer-Verlag Berlin and Heidelberg GmbH & Co. KG

Теглоt

795

Размери

155 x 235 x 29

Пълно описание

The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

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Wafer Bonding

Applications and Technology

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