Wafer-Level Chip-Scale Packaging

Name: Wafer-Level Chip-Scale Packaging
Brand: Springer-Verlag New York Inc.
SKU: 9781493915552
Price: 163.0 EUR
Availability: InStock

Analog and Power Semiconductor Applications

Автор: Shichun Qu, Yong Liu

Език:

Корици: С твърди корици

Издател: Springer-Verlag New York Inc.

Наличност: Външен склад

Изпращаме след 10-18 дни

163.00 € 318.80 лв

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in a...

Информация за книгата

Автор

Shichun Qu, Yong Liu

Език

Английски език

Корици

Книга - С твърди корици

Издадена

2014

страници

322

EAN

9781493915552

ISBN

149391555X

Enbook ID

02780828

Издател

Springer-Verlag New York Inc.

Теглоt

6944

Размери

155 x 235 x 24

Пълно описание

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.

Може също да ви хареса

Клиенти, които купиха тази книга, купиха също

Най-често търсени

Categories

Authors

Publishers

Продукти

Продукти

Най-често търсени

Categories

Authors

Publishers

Продукти

Продукти

Wafer-Level Chip-Scale Packaging

Analog and Power Semiconductor Applications

Информация за книгата

Пълно описание

Може също да ви хареса

Клиенти, които купиха тази книга, купиха също